28 October 2025, Taipei, Taiwan and Washington, D.C. – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) today announced it is collaborating  with NVIDIA, Stellantis and Uber to scale a collaborative development and deployment of Level 4 (hands-off, eyes-off) autonomous vehicles for robotaxi services on a global scale. Foxconn, the world’s largest electronics manufacturer and solutions provider, is bringing its expertise in high-performance computing, sensor integration, and electronic control systems to the partnership with NVIDIA, Stellantis, and Uber. In this collaboration, each partner contributes a unique strength: Foxconn’s hardware and integration know-how, NVIDIA’s advanced AI computing powered by NVIDIA DRIVE AGX Thor and the DRIVE AV software stack, Stellantis’ vehicle platforms, and Uber’s vast global network – forming a powerful alliance to advance autonomous mobility. These efforts center around developing Level 4-ready vehicles based on NVIDIA’s DRIVE AGX Hyperion 10 architecture, a reference compute and sensor platform that enables safe, scalable, and software-defined autonomous mobility. Foxconn Chairman Young Liu: “Autonomous mobility is a strategic priority within Foxconn’s EV program. The strategic partnerships and strengths across NVIDIA, Stellantis, and Uber accelerate the deployment of Level 4 robotaxi technology, with Foxconn delivering HPC, sensor integration to enable a global rollout.” NVIDIA Founder and CEO Jensen Huang: “Level 4 autonomy isn’t just a milestone for the auto industry – it’s a leap in AI capability. The vehicle becomes a robot – one that sees, perceives, plans, and drives with superhuman precision. By combining Stellantis’ global scale with NVIDIA DRIVE and Foxconn’s system integration, we’re creating a new class of purpose-built robotaxi fleets – making transportation safer, more accessible, and more affordable for everyone.” Stellantis CEO Antonio Filosa: “Autonomous mobility opens the door to new, more affordable transportation choices for customers. We have built AV-Ready Platforms to meet growing demand, and by partnering with leaders in AI, electronics, and mobility services, we aim to create a scalable solution that delivers smarter, safer, and more efficient mobility for everyone.” Uber CEO Dara Khosrowshahi: “NVIDIA is the backbone of the AI era and is now fully harnessing that innovation to unleash L4 autonomy at enormous scale, with Foxconn and Stellantis among the first to integrate NVIDIA’s technology for deployment on Uber. We are thrilled to work with Foxconn and Stellantis to bring the benefits of autonomous vehicles to millions of riders around the world.” Level 4 robotaxis require a sophisticated technology stack, including powerful computing, smart power management, reliable connectivity, and effective thermal control. They also rely on a wide assortment of sensors – such as LiDAR, radar, and multi-view cameras – working in concert to perceive the environment. In this collaboration, NVIDIA will develop and supply its NVIDIA DRIVE AV solutions built on the DRIVE AGX Hyperion 10 architecture, delivering Level 4 Parking and Level 4 Driving capabilities. Stellantis will design, engineer, and manufacture autonomous vehicles using its LCV platforms and STLA Small AV-Ready platforms, integrating NVIDIA DRIVE AV platform. Foxconn will partner with Stellantis on hardware and systems integration to ensure seamless vehicle architecture. Uber will operate the robotaxi services and expand its fleet with Stellantis-built, NDAS-powered vehicles, advancing autonomous mobility at scale.   About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 28th among the Fortune Global 500. In 2024, revenue totaled TWD6.86 trillion (approx. USD208 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40%. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – artificial intelligence, semiconductors and next-generation communications technology. Pulling it together with its three intelligent platforms – Smart Manufacturing, Smart EV, Smart City – the “3+3+3” strategy is key to driving the Group’s long-term growth. Foxconn is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com

28 October 2025, Taipei, Taiwan and Washington, DC – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) this week showcased, for the first time in the US capital, its latest smart manufacturing technologies being deployed across several states, and displayed the latest NVIDIA GB300 NVL72 AI infrastructure. At GTC Washington, DC – attended by many of the world’s largest electronics manufacturers and technology solutions providers – Foxconn signaled that the Group will continue to scale up AI server production across Texas, Wisconsin and California in partnership with NVIDIA to meet increasing customer demand. “Foxconn and NVIDIA share an excellent partnership. Our team is bringing the most advanced AI data center solutions to the United States, which will help our leading customers stay ahead in the AI race,” said Foxconn Chairman Young Liu, who participated in the keynote pregame broadcast for the second time this year. Attending GTC events, as well, was Foxconn Head of USA, Mexico and Canada, Jerry Hsiao, who is also a director of the DC-based National Association of Manufacturers (NAM), the largest industrial trade association in the United States, representing 14,000 member companies in every industrial sector in the US. With customer demand continuing to grow strongly, Foxconn has expanded its investments in AI server-related capabilities over the past year. Looking ahead, it will further evaluate the feasibility of expanding its investments based on industry trends and partnership opportunities. The Group’s strong R&D and integration capabilities in AI infrastructure also represents Taiwan’s critical role as a key hub in the global AI supply chain. Foxconn is currently working with NVIDIA in Houston to build a next-generation smart manufacturing plant for AI servers. The project leverages NVIDIA Omniverse libraries for upfront planning and scenario simulation to create an optimized factory environment – using NVIDIA AI physics framework,PhysicsNeMo, to develop an AI surrogate model for real-time thermal analysis, NVIDIA Isaac for AMR (Autonomous Mobile Robot) path planning, and NVIDIA Metropolis vision AI agents to monitor operations and enhance quality control. The factory will also be among the first to deploy humanoid robots powered by the NVIDIA Isaac GR00T N model on its production lines, as Foxconn and NVIDIA aim to build a world-leading benchmark AI smart factory. Foxconn has been in the US since 1985, with operations in the country comprising of more than 40 facilities across 12 states.

21, October 2025, Taipei, Taiwan – Hon Hai Research Institute (HHRI), an R&D powerhouse of Hon Hai Technology Group (“Foxconn”) (TWSE: 2317), the world’s largest electronics manufacturer and technology service provider, achieved a breakthrough in fault-tolerant quantum computing that was published in the prestigious scientific journal Nature Physics this month. The findings in the paper titled, “Constant-Overhead Magic State Distillation,” realizes the first optimal Magic State Distillation protocols, fixing the resource consumption for magic states at a level independent of the target output precision. This overcomes the long-standing bottleneck in previous protocols of fault tolerance quantum computation, where resources had to grow significantly as the target error rate decreased. The team, comprised of Min-Hsiu Hsieh, Director of the Quantum Computing Research Center at HHRI, together with HHRI researcher Adam Wills (now an MIT graduate student) and Prof Hayata Yamasaki from the University of Tokyo, utilized high-performance quantum codes, combined with transversal Clifford logical gates and efficient conversion mechanisms, ensuring that only a fixed number of input magic states are required to implement fault-tolerant T and CCZ gates—significantly enhancing the feasibility and efficiency of large-scale quantum computing. This technological breakthrough will strengthen Taiwan’s position in quantum computing and quantum error correction research, furthering HHRI’s commitment and excellence in quantum technologies. HHRI will continue advancing quantum computing research to contribute to global technological innovation and industrial progress. Nature Physics, a monthly peer-reviewed scientific journal, is one of the world’s most influential journal in the field of physics, publishing major breakthroughs and cutting-edge research. It boasts a high Impact Factor of 19.3, according to Journal Citation Reports. Acceptance by Nature Physics reflects exceptional scientific merit and substantial impact on the field. About Hon Hai Research Institute The institute, founded in 2020 and part of Hon Hai Technology Group (Foxconn), has five research centers. Each center has high technology R&D professionals, all of whom are focused on the research and development of new technologies, the strengthening of Foxconn’s technology and product innovation pipeline, efforts to support the Group’s transformation from "brawn" to "brains", and the enhancement of the competitiveness of Foxconn’s "3+3+3" strategy.

14 October 2025, San Jose, California – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) today announced it is collaborating with NVIDIA to implement the 800 VDC power architecture for AI factories announced at Computex 2025, marking the next step toward modern AI factory infrastructure. Foxconn’s subsidiary Ingrasys Technology showcased the latest NVIDIA GB300 NVL72 platform, integrated with an In-row CDU solution to achieve new levels of energy efficiency. Through continuous innovation in high-efficiency power and thermal design, Foxconn reinforces its leadership and highlights Taiwan’s pivotal role in the global AI supply chain. The new architecture will first be implemented in the Kaohsiung K-1 artificial intelligence data center project, which serves as a demonstration site for the Group’s capabilities in AI servers, data centers and renewable-energy integration and further solidifies Taiwan’s strategic position in the global AI supply chain. The latest collaboration between the bellwether technology partners, announced at the OCP Global Summit 2025 where Foxconn subsidiary Ingrasys also unveiled its latest NVIDIA GB300 NVL72 platform, highlights the Group’s commitment to deliver safer, more energy-efficient, and rapidly deployable AI factory and data center solutions. The 800 VDC power architecture is purpose-built for high-density AI workloads. It features a modular and scalable design that significantly reduces current and resistive losses, minimizes conductor usage, and simplifies power distribution – while improving energy-conversion efficiency and system safety. It also supports multiple future generations of NVIDIA Infrastructure platforms platforms, providing a reliable, efficient, and sustainable power foundation to meet the demands of next-generation AI computing. In addition, Foxconn’s subsidiary Ingrasys Technology also showcased a lineup of next-generation AI solutions, including NVIDIA GB300 NVL72, NVIDIA HGX B300 platform, and the new NVIDIA MGX servers designed for enterprise-grade AI applications. These innovations highlight Foxconn’s strong capabilities in AI infrastructure development, and system integration. About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 28th among the Fortune Global 500. In 2024, revenue totaled TWD6.86 trillion (approx. USD208 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40%. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – artificial intelligence, semiconductors and next-generation communications technology. Pulling it together with its three intelligent platforms – Smart Manufacturing, Smart EV, Smart City – the “3+3+3” strategy is key to driving the Group’s long-term growth. Foxconn is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com

26 August 2025, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is adopting NVIDIA RTX PRO Servers, an enterprise level data center infrastructure accelerated by NVIDIA RTX PRO 6000 Blackwell Server Edition GPUs. Foxconn will use NVIDIA RTX PRO Servers to accelerate GenAI deployment, agentic workflow design and simulation applications. “Achieving digital transformation in smart manufacturing requires the right foundation and technology. By introducing NVIDIA RTX PRO Servers into our global infrastructure, Foxconn is redefining the boundaries of AI-driven automation – from sophisticated robotics to intelligent logistics, agentic factory operations and smart electric vehicles,” said Young Liu, CEO and Chairman of Foxconn. Foxconn is deploying multiple use cases on RTX PRO Servers, including NVIDIA Omniverse for 3D digital twins to plan and simulate automated production lines, and NVIDIA Isaac for development and simulation of advanced autonomous mobile robots (AMRs). RTX PRO Servers are also featured in the NVIDIAEnterprise AI Factory validated design, empowering Foxconn to rapidly deploy full-stack, enterprise-grade AI infrastructure. Paired with NVIDIA BlueField-3 DPUs and NVIDIA ConnectX-8 SuperNICs, it integrates high-efficiency networking, storage, and cybersecurity accelerators to support a wide range of enterprise applications, including: ●      Industrial AI and robotics simulation (physical AI) ●      Generative AI and LLM inference (agentic AI) ●      Scientific computing and data analytics ●      Industrial design and real-time rendering This will be particularly valuable for Foxconn in advancing smart manufacturing, digital twins, and supply chain optimization. “Modern factories will exist in two worlds: one physical, one digital—perfect twins that look and behave the same,” said Jensen Huang, founder and CEO of NVIDIA. “NVIDIA RTX Pro is the platform of this revolution, built on simulation, graphics, and AI. Foxconn is leading the way, reinventing manufacturing for the era of AI and Omniverse digital twins.” RTX PRO Servers are expected to greatly boost Foxconn development efficiency and edge AI deployments, enabling multiple high-precision simulations to run in parallel and instantly see how different strategies perform. These systems provide Foxconn confidence to explore more complex scenarios and quickly identify the best solutions. For robotics and a wide range of AI applications, this means a smoother, faster path from concept to deployment. Foxconn is also an NVIDIA system partner and offers RTX PRO Servers through its Ingrasys business, based on the MGX reference design with 8 RTX PRO 6000 Blackwell GPUs: http://www.ingrasys.com/solutions/NVIDIA/nvidia_mgx_systems/Read more: http://nvidianews.nvidia.com/news/industry-leaders-transform-enterprise-data-centers-for-the-ai-era-with-nvidia-rtx-pro-servers About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 28th among the Fortune Global 500. In 2024, revenue totaled TWD6.86 trillion (approx. USD208 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40%. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – artificial intelligence, semiconductors and next-generation communications technology. Pulling it together with its three intelligent platforms – Smart Manufacturing, Smart EV, Smart City – the “3+3+3” strategy is key to driving the Group’s long-term growth. Foxconn is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com

22 August 2025, Taipei, Taiwan – Mitsubishi Fuso Truck and Bus Corporation (MFTBC) and Hon Hai Technology Group (“Foxconn”) (TWSE:2317) have signed a memorandum of understanding to explore strategic collaboration in zero emission buses, accelerating clean mobility for the Japanese commercial vehicle powerhouse and the world’s largest electronics manufacturer.As part of the collaboration that will strengthen the FUSO bus business, the two companies via their subsidiaries – Mitsubishi Fuso Bus Manufacturing Co., Ltd. (MFBM) and Foxtron Vehicle Technologies (TWSE:2258) – will cooperate in the development, production, supply chain management, and sales of ZEV buses, beginning with Foxtron-developed MODEL T and MODEL U.The four companies will use the MOU as a starting point to investigate future business models aimed at strengthening the FUSO brand and developing new, made-in-Japan buses. Through this initiative, the companies will provide products that meet a wider range of needs in the rapidly evolving bus market and achieve sustainable business growth.MFBM will serve as the operations platform for the development, production, and commercialization of buses in target markets, including exploring the introduction of made-in-Japan ICE and ZEV buses into target markets.With a track record in performance and safety, the award-winning, full-size MODEL T is already operating commercially as part of the public transit systems in Taiwan’s biggest cities. Universal and intelligent in mid-size mobility, MODEL U’s clean and simple appearance emphasizes flexibility and multi-functionality. About Mitsubishi Fuso Truck and Bus CorporationMitsubishi Fuso Truck and Bus Corporation (MFTBC) is a commercial vehicle manufacturer based in Kawasaki City, Japan. 89.29% of its shares are owned by Daimler Truck AG and 10.71% by various Mitsubishi group companies. MFTBC provides trucks, buses and industrial engines under the FUSO brand with a longstanding history of over 90 years, serving approximately 170 markets worldwide. MFTBC proactively develops cutting-edge technologies such as electrification, with its eCanter being Japan’s first mass-produced electric light-duty truck. MFTBC’s heavy-duty Super Great Truck was also the first of its kind in Japan to include SAE Level 2-equivalent automated driving support technology, now a benchmark in the Japanese commercial vehicle market.

Electromechanics, ICT, key markets get boost in new shares exchange30 July 2025, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) and TECO Electric & Machinery Co Ltd (“TECO”) (TWSE:1504) on Wednesday announced a share exchange, strategic alliance that will strengthen their AI infrastructure capabilities and propel the two Taiwanese tech majors into key markets in the global super-computing race. The move brings together the strengths of Foxconn, the world’s largest electronics manufacturing service provider and AI server producer, and TECO, a leader in industrial electro-mechanical engineering and green energy innovation. Seizing on the development of global AI data center (AIDC) construction towards standardization and modularization, the two companies will jointly explore AIDC business opportunities. Global customers will be able to tap comprehensive data center modular products, electromechanical engineering services, and cost-competitive, one-stop solutions. According to terms approved by both boards, respectively, TECO will take a 0.519% stake in Hon Hai Precision Industry Co Ltd, the formal name Foxconn trades on at the Taiwan Stock Exchange. In turn, Foxconn will own 10% in TECO. The latter will issue 237,644,068 new shares to Foxconn, and Foxconn will issue 72,481,441 new shares to TECO, implying a share exchange ratio of approx. 1 to 0.305. The no-cash transaction is targeted to complete in the fourth quarter of this year, conditional on regulatory approvals. Foxconn Chairman Young Liu said, “Time-to-market is key in the global super-computing race. Modular design is gaining popularity. As AI data centers grow in size and demand ramps higher, teaming up with TECO means both companies are able to level up and rapidly deliver comprehensive, vertically-integrated solutions to our customers – the Tier-1 CSPs and hyperscalers.” TECO Chairman Morris Li said, “Changing global dynamics are creating new opportunities for business and cooperation. The strategic partnership extends the two companies’ cooperation in the fields of low-carbon smart factories and energy services, toward being a one-stop solution for data centers going forward.” Target markets cover Taiwan and Asia, as well as the Middle East and the US. Foxconn has deep vertical integration capabilities in manufacturing AI server racks and an unrivaled customer base. Liu said Foxconn will actively develop a modular architecture for AI data centers, and with TECO aim to extend the value chain from server components and racks to data center construction. Li said that Texas-based TECO-Westinghouse, a longstanding world leader in manufacturing electric motors, has the advantages of American manufacturing and local services. Together with Foxconn's manufacturing base in the United States, it is in line with the strategic direction of the two companies to expand American manufacturing and reshape the global supply chain. Previously cooperating in factory energy saving and emission reduction, and ESCO energy services, TECO and Foxconn have started discussions on establishing data center business in Taiwan and the United States. Since a data center is mainly composed of equipment inside the computer room (servers, cooling systems, UPS, etc.) and power infrastructure outside the computer room, the strategic alliance integrates the combined strengths each bring in their respective fields of AI servers, electromechanics, and information and communications. Going forward, the strategic alliance will explore the possibility of expanding cooperation in Foxconn’s “3+3+3” areas. As bellwethers in sustainability, both companies will use the strategic alliance as a starting point to enhance a low-carbon smart industry chain that aligns with international trends, and support supply chain resiliency and innovation. Both TECO and Foxconn were named in S&P Global’s Sustainability Yearbook 2025, a milestone ranking that demonstrates corporate sustainability strength.   About TECO Founded in 1956 as a motor manufacturer, TECO Electric & Machinery Co., Ltd. (“TECO”) has grown into one of the world’s top five industrial motor producers. Today, TECO operates across three core business groups—Green Mechatronic Solutions, Intelligence Energy, and Air & Intelligent Life—building a green ecosystem for energy generation, storage, and efficiency. Beyond motors, TECO has expanded into ESCO energy services, EV powertrain systems, and data center engineering. The company is a market leader in Taiwan’s onshore substations for offshore wind (2.5 GW), has delivered over 700 MW of data center projects across Southeast Asia, and holds more than 85% of Taiwan’s e-bus powertrain market, with recent expansion into India. TECO’s vision is to become the key driver in realizing global electrification, intelligence, and green energy. It has been included for five consecutive years in both the Dow Jones Best in Class Indices and the S&P Global Sustainability Yearbook, and has received the Taiwan Corporate Sustainability Award for eleven straight years. To learn more, visit www.teco.com.tw   About Foxconn Established in 1974 in Taiwan, Hon Hai Technology Group (“Foxconn”) (TWSE:2317) is the world’s largest electronics manufacturer and leading technological solutions provider, ranking 28th among the Fortune Global 500. In 2024, revenue totaled TWD6.86 trillion (approx. USD208 billion). The Group’s market share in electronics manufacturing services (EMS) exceeds 40%. The Group operates over 230 campuses across 24 countries and is one of the world’s largest employers with approx. 900,000 employees during peak manufacturing season. The Group has expanded its capabilities into the development of electric vehicles, digital health, and robotics, and three key technologies – artificial intelligence, semiconductors and next-generation communications technology. Pulling it together with its three intelligent platforms – Smart Manufacturing, Smart EV, Smart City – the “3+3+3” strategy is key to driving the Group’s long-term growth. Foxconn is dedicated to championing environmental sustainability in the manufacturing process and serving as a best-practice model for global enterprises. To learn more, visit www.honhai.com

Multimodal Trajectory Prediction Model Competitively Recognized Internationally10 July 2025, Taipei, Taiwan – Hon Hai Research Institute (HHRI), an R&D powerhouse of Hon Hai Technology Group (Foxconn) (TWSE: 2317), the world’s largest electronics manufacturer and technology service provider, has been recognized for its competitive work in trajectory prediction in autonomous driving technology. The landmark achievements in ModeSeq, taking top spot in the Waymo Open Dataset Challenge and presenting at CVPR 2025, among the world’s most influential AI and computer vision conferences, gathering top-tier tech firms, research institutions, and academic leaders, highlight HHRI’s growing leadership and technical excellence on the international stage. “ModeSeq empowers autonomous vehicles with more accurate and diverse predictions of traffic participant behaviors,” said Yung-Hui Li, Director of the Artificial Intelligence Research Center at HHRI. “It directly enhances decision-making safety, reduces computational cost, and introduces unique mode-extrapolation capabilities to dynamically adjust the number of predicted behavior modes based on scenario uncertainty.”Figure 1: Illustrates the ModeSeq workflow, showing how the model anticipates multiple possible future trajectories (highlighted by red vehicle icons and arrows). It progressively analyzes the scenario and assigns confidence scores (e.g., 0.2) to each potential path.   HHRI’s Artificial Intelligence Research Center, in collaboration with City University of Hong Kong, on June 13, presented "ModeSeq: Taming Sparse Multimodal Motion Prediction with Sequential Mode Modeling" at CVPR 2025(IEEE/CVF Conference on Computer Vision and Pattern Recognition), where its paper was among only the 22% that were accepted. The multimodal trajectory-prediction technology overcomes the limitations of prior methods by both preserving high performance and delivering diverse potential outcome paths. ModeSeq introduces sequential pattern modeling and employs an Early-Match-Take-All (EMTA) loss function to reinforce multimodal predictions. It encodes scenes using Factorized Transformers and decodes them with a hybrid architecture combining Memory Transformers and dedicated ModeSeq layers. The research team further refined it into Parallel ModeSeq, which claimed victory in the prestigious Waymo Open Dataset (WOD) Challenge – Interaction Prediction Track at the CVPR WAD Workshop. The team’s winning entry surpassed strong competitors from the National University of Singapore, University of British Columbia, Vector Institute for AI, University of Waterloo and Georgia Institute of Technology. Building on their success from last year – where ModeSeq placed second globally in the 2024 CVPR Waymo Motion Prediction Challenge – this year’s Parallel ModeSeq emerged triumphant in the 2025 Interaction Prediction track. Led by Director Li of HHRI’s AI Research Lab, in collaboration with Professor Jianping Wang’s group at City University of Hong Kong and researchers from Carnegie Mellon University, ModeSeq outperforms previous approaches on the Motion Prediction Benchmark—achieving superior mAP and soft-mAP scores while maintaining comparable minADE and minFDE metrics. Figure 2: Director Yung-Hui Li (right) and Researcher Ming-Chien Hsu at CVPR 2025 presenting the latest advances in autonomous driving using ModeSeq.   About Hon Hai Research Institute Founded in 2020 under Hon Hai Technology Group, the institute comprises five research centers and one laboratory. Each unit houses high-tech researchers dedicated to forward-looking studies over a 3–7 year horizon. Their mission is to strengthen long-term innovation and product development to support Foxconn’s transformation toward a “Smart First” future and to bolster the company’s “3+3+3” strategic operating model.

Pioneering a new foundation for quantum cryptography with meta-complexity13 June 2025, Taipei, Taiwan  – Hon Hai Research Institute (HHRI), the research arm of Hon Hai Technology Group (Foxconn) (TWSE: 2317), the world’s largest electronics manufacturer and technology service provider, has achieved a significant breakthrough in quantum computing. Researchers from HHRI’s Quantum Computing Division have demonstrated the possibility of constructing quantum cryptography without relying on traditional one-way functions, using instead a novel theoretical framework known as meta-complexity. This groundbreaking result has been accepted at Crypto, the world’s leading conference in cryptography, highlighting HHRI’s advanced research capabilities and its growing influence in the global quantum technology landscape. Figure 1: Overview of the relationships between key quantum cryptographic primitives and quantum computational complexity. Black lines indicate known results or straightforward inferences; red lines highlight HHRI’s new discoveries.This groundbreaking research, led by Dr. Taiga Hirooka, a researcher at HHRI, in collaboration with Professor Tomoyuki Morimae of Kyoto University and scientific advisor to HHRI, is the first to establish a deep theoretical connection between core tools in quantum cryptography—such as one-way puzzles and quantum random number generators—and a fundamental decision problem known as GapK. The GapK problem centers on determining whether a given piece of information is intrinsically complex or can be succinctly described, offering a novel lens through which to understand the foundations of quantum cryptography.   This discovery not only establishes a new theoretical foundation for quantum cryptography, but also paves the way for the development of next-generation Proofs of Quantumness—a critical step toward constructing secure and verifiable quantum technologies. The work aligns with concurrent research from two international teams and is widely seen as marking a new chapter in the evolution of quantum cryptography.   Crypto (International Cryptology Conference) is one of the most prestigious and longest-running academic conferences in the field of cryptography. Established in 1981, it has become a cornerstone of the discipline—alongside Eurocrypt and Asiacrypt—and is one of the three flagship events organized by the International Association for Cryptologic Research (IACR). Crypto attracts leading researchers and industry pioneers from around the globe and has served as the launchpad for numerous foundational advances in cryptographic theory and practice. Publishing at Crypto is widely regarded as one of the highest honors in the field, representing a hallmark of excellence in theoretical rigor, technical innovation, and lasting impact.   HHRI’s latest breakthrough, now accepted at Crypto, not only enhances Taiwan’s presence in the field of quantum cryptography but also highlights Foxconn’s sustained investment and growing expertise in quantum computing. The Hon Hai Research Institute will continue to advance quantum computing research to drive global technological innovation and industrial progress. Crypto 2025：http://crypto.iacr.org/2025/   About Hon Hai Research Institute The institute, founded in 2020 and part of Hon Hai Technology Group (Foxconn), has five research centers. Each center has an average of 40 high technology R&D professionals, all of whom are focused on the research and development of new technologies, the strengthening of Foxconn’s technology and product innovation pipeline, efforts to support the Group’s transformation from "brawn" to "brains", and the enhancement of the competitiveness of Foxconn’s "3+3+3" strategy.

21 May 2025, Taipei, Taiwan – Foxconn continues to advance its digital health initiatives, unveiling a range of innovations at the 2025 GTC Taipei. Highlights include the AI-powered nursing collaborative robot, digital twin smart hospital development, and contributions to the global open-source medical imaging platform MONAI. These achievements will also be spotlighted during keynote sessions at GTC Taipei, underscoring Foxconn’s capabilities as a comprehensive smart healthcare solutions provider.   Leveraging Technology to Address Nursing Workforce Shortages: AI Collaborative Robot Enters Clinical Practice Amid the challenges of an aging population and critical nursing staff shortages, Foxconn has partnered with Taichung Veterans General Hospital (ranked among Newsweek’s World’s Best Smart Hospitals 2025), Kawasaki Heavy Industries, to co-develop Nurabot, an AI-powered nursing collaborative robot.          Nurabot is powered by Foxconn’s proprietary traditional Chinese large language model, FoxBrain, developed by the Hon Hai Research Institute (HHRI). The model supports TTS (text-to-speech), ASR (automatic speech recognition), and NLP (natural language processing), and is deployed via the Hon Hai Data Center. The robot is powered by Isaac for Healthcare, a physical AI platform built on NVIDIA’s three computers for healthcare robotics. NuraBot uses  the NVIDIA Jetson AGX Orin™system-on-moduleand is trainedusingNVIDIA Isaac Sim™ , a reference robotic simulation application built on NVIDIA Omniverse and running on NVIDIA OVX™ for physical-virtual simulation, enabling autonomous navigation, multimodal perception, and real-time environmental modeling.   In clinical applications, Nurabot performs repetitive tasks such as medication delivery, specimen transport, ward patrols, and patient education—helping reduce nurses’ workload by up to 30%. It also enhances care standardization and precision, enabling nursing staff to focus more on core patient care and clinical decision-making. Currently undergoing field trials at Taichung Veterans General Hospital, Nurabot is expected to be formally integrated into the hospital’s nursing team operations by the end of the year. Foxconn further elaborates on this application in the featured talk titled “AI Humanoid Collaborative Nursing Robots: Shaping the Future of Nursing and Care,” showcasing how AI and robotics help alleviate workforce burdens and reshape healthcare environments.   Launching a Smart Hospital Ecosystem: Digital Twin Deployment for Operational Simulation As part of its smart hospital initiatives, Foxconn is collaborating with several medical institutions under planning and construction, including the Evergreen Branch of Taichung Veterans General Hospital, Baishatun Tung Hospital – Mazu Hospital, and Cardinal Tien Hospital. These collaborations involveconstructingphysically accurate digital twins of smart medical environments with NVIDIA Omniverse™ libraries and technologies.   These digital twins are used across three stages of hospital development: planning and design, workflow simulation, and operational optimization. Even in the early stages of construction and operations, hospitals can simulate AI-driven clinical scenarios, optimize spatial flow, and validate service efficiency and patient experience in advance.   With the integration of NVIDIAVideo Search & Summarization Agent (VSS ), hospitals can analyze real-time video data, automatically identify medical events and anomalies, generate visual summaries, and send real-time alerts. These capabilities empower management teams to make timely, data-driven decisions that enhance care quality and operational performance.   These digital twin environments also serve as key deployment sites for Nurabot, enabling simulation of robot routes, task validation, and training scenarios in virtual space. This accelerates clinical onboarding and cross-site implementation, further optimizing hospital operations and realizing truly patient-centered smart healthcare services.   Contributing to MONAI Open-Source Medical AI Models: Advancing AI Imaging Innovation To advance core AI healthcare technologies, Foxconn has developed CoroSegmentater, a coronary artery segmentation model set to be contributed to the      MONAI Model Zoo as a shared open-source asset for the global medical AI community. Built on 256-slice CTA imaging and powered by MONAI’s Auto3Dseg framework, the model achieves high-precision 3D segmentation of cardiac and coronary structures. CoroSegmentater can be deployed on NVIDIA OVX™ and simulated using Isaac Sim™ to reconstruct heart anatomy and vascular dynamics. It supports various clinical applications, including AI-assisted diagnostics, preoperative planning, and patient communication. The model is being featured in a special session at GTC Taipei, presented by David Niewolny, Sr. Director of Healthcare Business Development at NVIDIA. This contribution reflects Foxconn’s R&D strength in smart healthcare algorithms and its commitment to advancing global medical AI through open collaboration.   Driving Digital Health Globalization and Expanding AI Healthcare Impact Through its collaborationwith NVIDIA and the cross-sector network of HiMEDt (Taiwan Digital Health Alliance), Foxconn is actively promoting the international expansion of Taiwan’s smart healthcare innovations. Moving forward, Foxconn will further enhance its smart hospital AI platforms, robotic applications, and clinical AI model development to transition global smart healthcare from proof-of-concept to large-scale implementation—paving the way toward a truly patient-centered intelligent care ecosystem.